Alpha and Omega Semiconductor Limited released a family of low on-resistance 8V, 20V, and 30V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

What's the point of having the hottest high-performance chip available when it doesn't fit on the board? We've all heard horror stories about chips not meeting timing closure or not working when ...

If you thought a chip like AMD's MI300A was big at 146 billion transistors, you ain't seen nothing yet. AI company Cerebras announced its third-generation AI chip, CS-3, a "wafer-scale" silicon ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...