Even when the subject comes from a specific event, I’m always aiming for something universal: how people perform, collide and ...
Researchers from the Institute of Science Tokyo and Canon ANELVA Corporation built an ultrathin ferroelectric memory ...
SK hynix unveiled its next generation of artificial intelligence memory chips, including a 16-layer HBM4, at CES 2026 in Las Vegas on Tuesday. The chipmaker opened a customer-only exhibition booth to ...
SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...
Yonhap News Agency on MSN
SK hynix to showcase advanced 16-layer HBM4 chip at CES 2026
SK hynix Inc. said Tuesday it will showcase its latest high bandwidth memory (HBM) chip, a 16-layer HBM4 with a capacity of ...
AMD also is updating its workstation-level Ryzen AI Max+ mobile processors with two new models: the 12-core Ryzen AI Max+ 392 ...
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